Speakers
Dr. Jun Fan
Topic: Via and Via Array Modeling on Crosstalk
Dr. Fan holds a bachelor’s and master’s degree in Electrical Engineering from Tsinghua University, Beijing, and a Ph.D. in Electrical Engineering from the University of Missouri-Rolla (now the Missouri University of Science and Technology) where he is an assistant professor. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, intra-system EMI and RF interference, PCB noise reduction, differential signaling, and cable/connector designs. He is vice chair of the IEEE EMC Society Technical Advisory Committee and was a distinguished lecturer of the Society in 2007 and 2008.
Mr. Howard Heck
Topic: USB 3.0 Electrical Challenges and Solutions
Mr. Heck earned the B.S.Ch.E. degree from Northwestern University and the M.S.E.E. degree from the National Technological University. While working at IBM, he developed high performance printed circuit board and chip packaging technologies, including HyperBGA™ technology. Since joining Intel, he has focused on R&D for high speed inter-chip interconnect. He currently leads development of the specifications and interconnect solutions for 5 Gb/s SuperSpeed USB technology. An IEEE senior member, he holds six patents in high performance packaging and interconnects, with three more pending. He is co-author of Advanced Signal Integrity for High-Speed Digital Designs, a graduate level textbook.
Dr. Jon Martens
Topic: Improved De-Embedding Techniques for Highly-Coupled Multiport Fixtures
Dr. Jon Martens holds a Ph.D. in electrical engineering from the University of Wisconsin. Since 1995, he has been with the Anritsu Company working on measurement system architectures, calibration and de-embedding algorithms, and RF/analog circuit design. He is a senior member of the IEEE serving on the International Microwave Symposium technical program committee, the MTT measurements subcommittee, and the ARFTG executive committee.
Dr. Raj Mittra
Topic: Gems: A General-Purpose Electromagnetic Solver For Emi/Emc Problems Arising In Electronic Packages
Dr. Mittra is a professor in the Electrical Engineering department at Penn State University and director of the Electromagnetic Communication Laboratory. He is a life fellow of the IEEE and president of RM Associates, a consultant to industrial and governmental organizations. His professional interests include communication antenna design, RF circuits, computational electromagnetics, electromagnetic modeling and simulation of electronic packages, EMC analysis, radar scattering, frequency selective surfaces, microwave and millimeter wave integrated circuits, and satellite antennas. He has published more than 700 journal papers and 35 books or chapters and has three patents on communication antennas to his credit.
Dr. Ransom Stephens
Topic: Jitter
Dr. Stephens has written more than 200 articles in the electronics industry, science journals, and magazines on subjects ranging from global warming to parenting teenagers. He has worked in laboratories and universities across the United States and Europe, a startup company and a corporation specializing in extracting signals from noise. Ransom has served on high data rate standards committees, led an engineering commando team, and given keynote speeches on motivational topics like "The Big Picture and Big Decisions" and "The Fabric of Reality." Ransom has a reputation as a fun and entertaining speaker who delivers a clear understanding of complex topics.
